DRIE / ICP Fl

The Oxford Fl based tool runs in ICP and DRIE mode, but requires extensive cleaning to go from one mode to another. To assure high levels and cleanliness and more repeatable processing, etching is limited to either ICP or DRIE etching depending on the week. A schedule of the current and planned modes can be found here: ICP/DRIE Calendar

ICP Cl

Plasma Asher

RIE

UV Ozone

Vapor HF

XeF2