Instruments and Tools
Back End Processing
Dicing Saw ›The Disco DAD3220 is a single spindle dicing saw, capable of handling work-pieces up to a maximum of 6” square or 6” in diameter.
Spin Rinse Dryer ›The spin rinse dryer offers a fast way to clean and dry wafers in patches up to 25 wafers at a time.
Tape Mounter ›The Ultron UH114 mounts wafers to dicing tape and a metal frame to be used with the Disco Dicing Saw.
Wire Bonder ›The West Bond Wire Bonder is a semi-automatic wire bonder that can accommodate both wedge and ball bonding to interconnect aluminum or gold wire leads to devices.