Dicing Saw

photo: Disco model DAD3220 dicing saw

The Disco DAD3220 is a single spindle dicing saw, capable of handling work-pieces up to a maximum of 6” square or 6” in diameter. The system features an LCD touch panel, auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. The 1.5 kW spindle features a shaft lock function for easy blade changes.

An Ultron Systems Tape Mounter and a UV Curing System are also available to be used in conjunction with the dicing saw.

Processes

Silicon substrates < 0.7 mm thick

Glass substraets < 1.2 mm thick


Contacts

  • Milan Begliarbekov, Ph.D.
    Technical Cleanroom Manager, Nanofabrication Facility
    Research Assistant Professor, Nanoscience Initiative
    mbegliarbekov@gc.cuny.edu

Manufacturer / Model

Disco / DAD3220

Facility

Nanofabrication Facility

Keywords

backend