Dicing Saw

The Disco DAD3220 is a single spindle dicing saw, capable of handling work-pieces up to a maximum of 6” square or 6” in diameter. The system features an LCD touch panel, auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. The 1.5 kW spindle features a shaft lock function for easy blade changes.

An Ultron Systems Tape Mounter and a UV Curing System are also available to be used in conjunction with the dicing saw.

Processes

Silicon substrates < 0.7 mm thick

Glass substraets < 1.2 mm thick

Contacts

• Shawn Kilpatrick
  Lab Manager, Nanofabrication Facility
  skilpatrick@gc.cuny.edu