Wire Bonder

The West Bond Wire Bonder is a semi-automatic wire bonder that can accommodate both wedge and ball bonding to interconnect aluminum or gold wire leads to devices. Three ultrasonic bonding methods can be executed; wedge bonding with angled wire feed for best loop control, wedge bonding with vertical feed for access to deep workpieces, selected by exchanging only the clamp assemblies; and ball bonding of gold wire with electronic flame off, selected by exchanging tool assemblies.

Contacts

• Shawn Kilpatrick
  Lab Manager, Nanofabrication Facility
  skilpatrick@gc.cuny.edu