![photo: West Band wire bonder](https://asrc.gc.cuny.edu/wp-content/uploads/media/instruments/wire-bonder/nanofab-back-end-wire-bonder.jpg)
Wire Bonder
![photo: West Band wire bonder](https://asrc.gc.cuny.edu/wp-content/uploads/media/instruments/wire-bonder/nanofab-back-end-wire-bonder.jpg)
The West Bond Wire Bonder is a semi-automatic wire bonder that can accommodate both wedge and ball bonding to interconnect aluminum or gold wire leads to devices. Three ultrasonic bonding methods can be executed; wedge bonding with angled wire feed for best loop control, wedge bonding with vertical feed for access to deep workpieces, selected by exchanging only the clamp assemblies; and ball bonding of gold wire with electronic flame off, selected by exchanging tool assemblies.
Contacts
- Shawn Kilpatrick
Lab Manager, Nanofabrication Facility
skilpatrick@gc.cuny.edu