All Facilities | All Instruments
Nanofabrication Facility
Instruments and Tools
Etching
-
Inductively Coupled Plasma Etch – Chlorine Based (ICP Cl) ›
The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system which can accommodate pieces to wafers up to 6” in diameter.
-
Inductively Coupled Plasma Etch – Fluorine Based (ICP Fl) ›
The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system which can accommodate pieces to wafers up to 6” in diameter.
-
Plasma Asher ›
The PVA Tepla IoN 40 is a plasma processing system configured for etch, strip, clean and surface treatment of wafers.
-
Reactive Ion Etch (RIE) ›
The Oxford PlasmaPro NPG80 RIE is an open-load medium plasma density system configured for fluorine-based etch chemistries.
-
Vapor Hydrofluoric Acid Etcher ›
The SPTS Primaxx Vapor HF Etcher is used primarily for isotropic etching of all types of SiO2 and offers a safer alternative to liquid- HF processes.
-
Xenon Difluoride Etcher ›
The SPTS Xactix E1 Xenon Difluoride Etcher can be used to isotropically etch Si, Ge, and Mo films.
