Inductively Coupled Plasma Etch – Fluorine Based (ICP Fl)

The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system which can accommodate pieces to wafers up to 6” in diameter.  The system is configured for Fluorine-based etching, including a variety of silicon based materials and various dielectrics. The system has a 600 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at temperatures varying from 0 C to +80 C. The Cobra process chamber walls are fitted with an electrical heating kit, allowing for warming to approximately 80 C.

Processes

• Gases: O2, Ar, N2, CHF3, CF4, C4F8, SF6

Contacts

• Emma Anquillare, Ph.D.
  Research Scientist, Nanofabrication Facility
  eanquillare@gc.cuny.edu