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Nanofabrication Facility

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Instruments and Tools

Deposition

  • photo: Ultratech Atomic Layer Deposition (ALD) system

    Atomic Layer Deposition (ALD) System ›

    The Ultratech Fiji G2 system is a load-locked ALD system capable of both thermal and plasma-enhanced depositions of various dielectric and metallic films
  • photo: AJA Internaitonal orion 8 RF sputter system

    DC/RF Sputter Deposition System ›

    The AJA Orion Sputtering System is a load-locked sputtering system capable of depositing metal and dielectric films over a substrate up to 6 inches in diameter.
  • photo: AJA International e-beam and thermal evaporation system

    E-beam & Thermal Evaporation System ›

    The AJA Orion 8E Evaporator System is capable of both electron beam (e-beam) and thermal evaporation.
  • photo: mini tytan 4600 furnace stack

    LPCVD Furnace Stack ›

    The Tystar Mini Tytan Furnace Stack contains two low pressure tubes that are used to process batches of up to 25 6-inch or 4-inch wafers.

  • Organics/Oxides E-beam Evaporator ›

    The AJA Organic evaporator is a combination ebeam and thermal evaporator. The ebeam evaporator in the tool is primarily used to evaporate oxides and magnetic materials. The thermal evaporators are used to evaporate low melting point materials, such as organic semiconductors.
  • photo: Oxford Instruments PECVD System

    Plasma Enhanced Chemical Vapor Deposition System (PECVD) ›

    The Oxford PlasmaPro System 100 PECVD is load-locked tool, capable of depositing silicon oxide, silicon nitride, amorphous silicon, and other films.
  • Photo: Cressington sputter coater

    Sputter Coater ›

    Sputter coating uses ionized argon to vaporize gold atoms from a target and deposit them in a thin layer onto a sample.