Atomic Layer Deposition (ALD) System

photo: Ultratech Atomic Layer Deposition (ALD) system

The Ultratech Fiji G2 system is a load-locked ALD system capable of both thermal and plasma-enhanced depositions of various dielectric and metallic films. The use of remote plasma activation is essential for the deposition of high quality nitrides. Also, plasma activation of oxide precursors generally enhance film nucleation on non-standard substrates.

Processes

Films: Al2O3, HfO2, TiO2, TiN, ZnO, MgO, ZrN


Contacts

  • Milan Begliarbekov, Ph.D.
    Technical Cleanroom Manager, Nanofabrication Facility
    Research Assistant Professor, Nanoscience Initiative
    mbegliarbekov@gc.cuny.edu

Manufacturer / Model

Ultratech/Cambridge NanoTech / Fiji G2

Facility

Nanofabrication Facility

Keywords

deposition