Policies, Procedures and Resources

Instrument Policies and Operating Procedures


Standard Operating Procedures (SOP) by Instrument

Dicing SawDownload SOP

Spin Rinse Dryer – none

Tape Mounter – none

Wire Bonder – none

Atomic Layer Deposition SystemDownload SOP

E-beam and Thermal Evaporating System – none

LPCVD Furnace Stack – none

Plasma Enhanced Chemical Vapor Deposition System (PECVD)Download SOP

RF Sputter Deposition SystemDownload SOP

Sputter CoaterDownload SOP

Inductively Coupled Plasma Etch – Chlorine Based (ICP Cl) – none

Inductively Coupled Plasma Etch – Fluorine Based (ICP Fl) – none

Plasma AsherDownload SOP

Reactive Ion Etch (RIE) – none

Vapor Hydrofluoric Acid Etcher (Vapor HF)Download SOP

Xenon Difluoride Etcher (XeF2)Download SOP

3D Lithography SystemDownload SOP

Curing Ovens – none

Electron Beam Lithography SystemDownload SOP

Mask AlignerDownload SOP

Spin Coater – E-Beam Resists – none

Spin Coater – Photoresist and Other – none

UV Ozone CleanerDownload SOP

3D Optical ProfilerDownload SOP

Atomic Force Microscope (AFM) – none

EllipsometerDownload SOP

Field Emission Scanning Electron Microscope (FE-SEM)Download SOP

Inspection Microscopes – none

Probe Station – none

Stylus Profiler Download SOP

Thin Film Analyzer – none

Furnace Stack – none

Rapid Thermal Anneal (RTA) – none

Additional Instrument Policies

All users of the AJA e-beam evaporators are required to sign-up for the Nanofabrication Facility Slack site. Please read the instructions on how to sign-up and utilize Slack.

Joining Slack Channels

The Nanofabrication Facility Slack site utilizes channels #ebeamevaportor for ongoing discussions between users on crucible changes. Once you have access to the Slack page, you can join these channels with the following steps:

Click on CHANNELS on the top left of the Slack site
This will open the channel browser, where you can search, sort, and explore all the channels.
To join a specific channel, click the Join Channel button and you will then have access to these topic specific channels.

E-Beam Evaporator Material Changes

Chamber venting and material changes will be carried out on Mondays and Thursdays from 5PM to 9PM by Nanofabrication staff only.

  1. All material changes will be scheduled using the Google Sheets Doc.
  2. There are two tabs, one showing the currently installed materials (titled “Materials”) and one schedule the upcoming material changes (titled “Upcoming Changes”).
  3. Fill in the material you need on the appropriate pocket and chamber vent date. Remember to add your email, e.g. Ag (xxxx@email.edu).
  4. You can also add comments in the cell to the far right of the sheet.
  5. Please use the Slack Channel #ebeamevaportor for any discussions with fellow users and staff as needed, however the Upcoming Changes list will be the final scheduling tool.
  6. Never delete another users’ entry.
  7. Bring up any scheduling issues via the Slack channel.
  8. Cr, Ti and Au will always be kept in the chamber unless staff have reason to change it out temporarily. This will be communicated if we do so.
  9. Please be considerate when filling out your slots. staff always have the right to make changes (with sufficient notification) and will monitor any abuse of scheduling.

Download Sputter Parameters Table (PDF)

RF Sputter Slack

All users of the RF Sputter Deposition System are required to sign-up for the Nanofabrication Facility Slack site and use the #sputterdeposition channels for ongoing discussions between users on target.

How to sign-up for and use Slack »

Once you have access to the Slack site, you can join these channels with the following steps:

  • Click CHANNELS in the top left of the Slack site
  • This will open the channel browser, where you can search, sort, and explore all the channels.
  • To join a specific channel, click the Join Channel button.

Sputter Target Changes

A minimum of two days prior to possibly changing out a material, users must post their proposed material change in the appropriate Slack channel. When posting your proposal, you must state the following:

  • The material you are putting in
  • The material you are proposing to take out
  • The length of time you will need the material to stay in the chamber

A discussion amongst users can then be had through Slack to collaboratively plan the appropriate time and date of the change. We ask that you be considerate of other users’ needs and try to coordinate in such a way to minimize venting the chamber.

When you change the materials at the tool you must update the Google Doc to reflect the changes. This can be done at the AJA deposition computer.

View the current list of installed targets and crucibles »
(This link is also pinned on the Slack channels.)

The Oxford PlasmaPro System runs in ICP and DRIE mode, but requires extensive cleaning to go from one mode to another. To assure high levels and cleanliness and more repeatable processing, etching is limited to either ICP or DRIE etching depending on the week.

View a schedule of current and planned modes »