![photo: Disco model DAD3220 dicing saw](https://asrc.gc.cuny.edu/wp-content/uploads/media/instruments/dicing-saw/nanofab-back-end-dicing-saw.jpg)
Dicing Saw
![photo: Disco model DAD3220 dicing saw](https://asrc.gc.cuny.edu/wp-content/uploads/media/instruments/dicing-saw/nanofab-back-end-dicing-saw.jpg)
The Disco DAD3220 is a single spindle dicing saw, capable of handling work-pieces up to a maximum of 6” square or 6” in diameter. The system features an LCD touch panel, auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. The 1.5 kW spindle features a shaft lock function for easy blade changes.
An Ultron Systems Tape Mounter and a UV Curing System are also available to be used in conjunction with the dicing saw.
Processes
Silicon substrates < 0.7 mm thick
Glass substraets < 1.2 mm thick
Contacts
- Shawn Kilpatrick
Lab Manager, Nanofabrication Facility
skilpatrick@gc.cuny.edu