Atomic Layer Deposition (ALD) System

The Ultratech Fiji G2 system is a load-locked ALD system capable of both thermal and plasma-enhanced depositions of various dielectric and metallic films. The use of remote plasma activation is essential for the deposition of high quality nitrides. Also, plasma activation of oxide precursors generally enhance film nucleation on non-standard substrates.

Processes

Films: Al2O3, HfO2, TiO2, TiN, ZnO, MgO, ZrN

Contacts

• Suresh Rai
  Cleanroom Engineer, Nanofabrication Facility
  srai@gc.cuny.edu