ICP Cl

The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system which can accommodate pieces to wafers up to 6” in diameter.  The system is configured for Chlorine-based etching, including a variety of metals, dielectrics, silicon based materials, and II-V compound semiconductors.

The system has a 600 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at temperatures varying from 0 C to +80 C. The Cobra process chamber walls are fitted with an electrical heating kit, allowing for warming to approximately 80 C.

Equipment Type

Inductively Coupled Plasma (ICP)

Manufacturer

Oxford Instruments

Model

PlasmaPro System 100/1 Cobra

Location

Plasma Bay

Processes

Gases: BCl3, Cl2, O2, CH4, H2, CF4, Ar, N2