RF Sputter Deposition System
Gases: Ar, O2, N2, and H2/N2
Targets: Al, Cr, Co, Cu, ITO, MoSi2, Ni, Si, SiO2, Si3N4, Ta2O3, Ti, TiN, TiO2, W, ZnO
The AJA Orion Sputtering System is a load-locked sputtering system capable of depositing metal and dielectric films over a substrate up to 6 inches in diameter. It is equipped with seven AJA high vacuum magnetron sputtering sources that are powered by two RF generators (300W) and three DC generators (750W) for single or multi-layer deposition or co-sputtering. Computer control provides recipe generation and process data storage. The max substrate is 4” with rotation 0-40 RPM, radiant heating to 850 ˚C, and RF/DC biasing with 100 W RF generator for substrate pre cleaning. Process gasses listed below are also available for reactive sputter deposition.